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Additive engineering of CBP molecules for defects passivation and
moisture stability of hybrid perovskite layer

Additive engineering is the way to handle grain boundary defects in solution processed halides perovskites semiconductor thin-films. Most of the moieties used for this role are known to be n-type small organic molecules like PCBM, BCP, amine-based compounds or insulating large Eg molecules PEO, PMMA, PS, etc. However, this is the first report we demonstrate that a commonly known p-type organic small molecule (CBP) can also passivate the defects at grain boundaries to reduce optical losses and overall improved performance of the perovskite solar cells (PSCs) in terms of efficiency and moisture/thermal stability. This work is carried out in collaboration with Physics Department (Prof. Kabra) and MEMS (Prof. Bhargava and Prof. Mallick) as a part of deliverable of NCPRE- IIT Bombay funded by MNRE-India.

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Figure: Schematic diagram of Pristine MAPbI 3 and MAPbI 3 +CBP
and JV curve of p-i-n devices where x is CBP concentration

https://doi.org/10.1016/j.solener.2020.10.035

Alps
Boskey
Sharma
Alps
Prof. Sudhanshu
Mallick
Alps
Prof. Parag
Bhargava
Alps
Prof. Dinesh
Kabra



dkabra@iitb.ac.in
mallick@iitb.ac.in
pbhargava@iitb.ac.in